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TSMC working towards a future with trillion-transistor chips, 1nm-class manufacturing

At the recent IEDM conference, TSMC unveiled a product roadmap for its semiconductors and next-generation production nodes that culminates in eventually delivering multiple 3D-stacked collections of chiplet designs (3D Hetero Integration) with one trillion transistors on a single chip package. Advancements in packaging technologies, such as CoWoS, InFO and SoIC,...

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https://www.techspot.com/news/101364-tsmc-working-towards-future-trillion-transistor-chips-1nm.html?utm_source=dlvr.it&utm_medium=blogger

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